000 00522nam a2200193Ia 4500
003 BD-DhNLB
005 20230124141934.0
008 180101s2013 ii ||||| |||| 00| 0 eng d
040 _aBD-DhNLB
041 _heng
082 _a621.3815
_223
_bJOM2013
100 _aJohn H.Lau &S.W.Ricky Lee
_928701
245 0 _aMicrovias:
_bFor Low Cost,High Density Interconnects/
260 _aNew Delhi:
_bMc.Grawhill
_c2013
300 _a565
_c21cm.
650 _aIntegrated Circuits
_96239
942 _2ddc
_cBK
999 _c26965
_d26965