000 | 00522nam a2200193Ia 4500 | ||
---|---|---|---|
003 | BD-DhNLB | ||
005 | 20230124141934.0 | ||
008 | 180101s2013 ii ||||| |||| 00| 0 eng d | ||
040 | _aBD-DhNLB | ||
041 | _heng | ||
082 |
_a621.3815 _223 _bJOM2013 |
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100 |
_aJohn H.Lau &S.W.Ricky Lee _928701 |
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245 | 0 |
_aMicrovias: _bFor Low Cost,High Density Interconnects/ |
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260 |
_aNew Delhi: _bMc.Grawhill _c2013 |
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300 |
_a565 _c21cm. |
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650 |
_aIntegrated Circuits _96239 |
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942 |
_2ddc _cBK |
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999 |
_c26965 _d26965 |