TY  - BOOK
AU  - John H.Lau &S.W.Ricky Lee
TI  - Microvias: For Low Cost,High Density Interconnects
U1  - 621.3815 23
PY  - 2013///
CY  - New Delhi
PB  - Mc.Grawhill
KW  - Integrated Circuits
ER  -