John H.Lau &S.W.Ricky Lee <br/><br/>
Microvias:  For Low Cost,High Density Interconnects/ 

 - New Delhi:  Mc.Grawhill  2013 
 - 565  21cm. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Integrated Circuits
<br/><br/><label>Dewey Class. No.: </label>621.3815  / JOM2013